BGA solder balls for reballing, i.e. repositioning the solder balls on BGA components using a stencil
Solder ball diameter: 0.45 mm,
Tolerance: 0.015mm
Solder alloy: Sn96.5Ag3.0Cu0.5, lead-free
Melting temperature: 217°C- 219°C
Content: 250000 pieces
Weight: 0.12 kg
technical information:
Every metal has the property of forming an oxide layer under oxygen, which grows over time and must be broken up by a flux in the soldering process. We recommend the use of Interflux IF8300/4-030 flux gel for the reballing process, which is intensified by high temperatures and/or high humidity and body perspiration. For ideal storage and use, please note and counteract this. The ideal storage temperature is 25°C +/- 5 °C at a humidity of 60 +/- 20%, the minimum shelf life is 12 months from production.
