BGA solder balls for reballing, i.e. repositioning the solder balls on BGA components using a stencil.
Solder ball diameter: 0.55 mm,
tolerance: 0.015 mm
solder alloy: Sn96.5Ag3.0Cu0.5, lead-free
Melting point: 217°C- 219°C
Contents: 250000 pieces
Weight: 0.24 kg
Technical note:
Every metal has the property of forming an oxide layer when exposed to oxygen. This layer grows over time and must be broken up by a flux in the soldering process. We recommend using the flux gel Interflux IF8300/4-030 for the reballing process. This process is enhanced by high temperatures and/or high humidity as well as body perspiration. Please take these factors into account and take appropriate action to ensure ideal storage and use. The ideal storage temperature is 25°C +/- 5°C at a humidity of 60 +/- 20%, and the minimum durability is guaranteed for 12 months from the date of manufacture.
